Teledyne SP Devices

SP Devices introduced its second EVM with Texas Instruments

SP Devices today introduced its second evaluation module (EVM) with Texas Instruments (TI). This new EVM combines TI's fastest 12-bit analog-to-digital converters (ADCs) in an interleaved fashion with a Xilinx® Virtex®-5 FPGA to create the best-performing high-speed digitizer solution in the market. The FPGA comes pre-installed with SP Devices' proprietary time-interleaving technology to eliminate interleaving spurs, which enhances performance and facilitates rapid system-level evaluation for wireless communications, military, test and measurement applications. The EVM joins TI's portfolio of support tools for customers using high-speed data converters in wide-bandwidth applications.


Press Release

Product Information

"The technical and intellectual support from the team at Teledyne SP Devices has been playing an important role in our research."

Associate Professor at Hong Kong University (HKU)
who has implemented a system supporting line scan rates of 10M lines/s

Send us an email, call our headquarters or check our Contact page to find your local sales representative.
Email Us 
Sign up for our newsletter and stay up-to-date on new products and updates.
Sign Up For Newsletter 
ISO logo

We use cookies on our website. Some of them are essential for the operation of the site, while others help us to improve this site and the user experience (tracking cookies). You can decide for yourself whether you want to allow cookies or not. Please note that if you reject them, you may not be able to use all the functionalities of the site.