Teledyne SP Devices

SP Devices welcomes three new employees.

New engineers at SP Devices

Two of the new engineers have experience in the design of software‑defined radio and chip design. They will use their experience and expertise at SP Devices to work with PCB design and algorithm implementation. The third engineer is experienced in programming, electronics design and embedded systems, and will strengthen SP Devices’ resources in FPGA technology and programming.

"The technical and intellectual support from the team at Teledyne SP Devices has been playing an important role in our research."

Associate Professor at Hong Kong University (HKU)
who has implemented a system supporting line scan rates of 10M lines/s

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