Meet us at BiOS & PW!

SPIE BiOS & PW

We are happy to announce that we will be exhibiting at SPIE BiOS & PW 2019. The exhibition will be taking place at The Moscone Center, San Francisco, California, United States, from February 2 until February 7, 2019. For more information on our innovative products and to meet our team, please visit our booths #8352 (BiOS) and #3306 (PW). You can also book a meeting in advance.

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"The technical and intellectual support from the team at Teledyne SP Devices has been playing an important role in our research."

Associate Professor at Hong Kong University (HKU)
who has implemented a system supporting line scan rates of 10M lines/s

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