Teledyne SP Devices

SP Devices' technology in module from Texas Instruments

Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced an evaluation module (EVM) that combines TI's fastest 14-bit analog-to-digital converters (ADCs) in an interleaved fashion with a Xilinx® Virtex®-5 FPGA to create the best-performing high-speed digitizer solution in the market. The FPGA comes pre-installed with SP Devices' proprietary time-interleaving technology to eliminate interleaving spurs, which enhances performance and facilitates rapid system-level evaluation for wireless communications, military, test and measurement applications. The EVM joins TI's portfolio of support tools for customers using high-speed data converters in wide-bandwidth applications.

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Press release

Product Information (TI)

Product information (SP Devices)


"The technical and intellectual support from the team at Teledyne SP Devices has been playing an important role in our research."

Associate Professor at Hong Kong University (HKU)
who has implemented a system supporting line scan rates of 10M lines/s

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